Focusing on thermal management, Sungrow E-Power contributes new solutions

On September 5-6, 2024, the 3rd China Advanced Thermal Management Technology Summit was held in Shanghai. Over 300 industry representatives discussed and exchanged ideas on hot topics such as thermal management of new energy power devices, liquid cooling technology, chip packaging, and high-performance intelligent driving platforms. Sungrow E-Power was invited to attend the conference and share key technologies for heat dissipation design of motor controller power modules.

The upgrading of intelligent electric vehicle technology is accelerating, and the integration of electric drive systems is constantly improving. If effective thermal management cannot be implemented for its core power module, it will have a negative impact on system performance, reliability, and service life.

Based on years of experience in efficient motor controller development, Sungrow E-Power has sufficient technical reserves in heat dissipation design. The newly mass-produced TPAK parallel module innovatively applies direct welding technology for power devices, significantly improving heat dissipation performance. Combined with high-precision junction temperature estimation technology, it fully utilizes the current output capability of the device, helps improve the efficiency of the control system, and enhances the overall power performance of the vehicle.

From detail optimization to platform iteration, Sungrow E-Power adheres to technological innovation to ensure product performance and quality, providing customers with high-value motor controller and on-board charger systems, and strengthening market competitiveness.