CIAS 2024 | Parallel connection of power devices helps electric drive systems to be flexible and efficient

On April 23-24, the CIAS 2024 Power Semiconductor New Energy Innovation and Development Conference was grandly held in Suzhou. Sungrow E-Power was invited to attend the Automotive Electronics Innovation Forum and gave a detailed introduction to the innovative application of the new generation power device parallel connection scheme in electric drive systems.

The booming development of intelligent electric vehicles has put forward higher requirements for the integration, reliability, and adaptability of electric drive systems. Sungrow E-Power has been focusing on power electronics application technology for many years, and has developed multiple inverter products based on power device parallel technology. The new generation of parallel modules used today use TPAK packaging devices, with flexible power configuration and easy switching of Si and SiC power semiconductors, compatible with 400V/800V voltage platforms; The structural layout is flexible and diverse, meeting the integration requirements of pure electric and hybrid power domains, and reducing space occupation. With high adaptability, we create customized electric drive system solutions to help customers quickly respond to market changes. We also carry out professional current sharing scheme design, noise parameter optimization, and reliability verification for parallel modules to ensure the efficient and stable operation of the product.

During the meeting, Sungrow E-Power also communicated with numerous OEM customers and domestic and foreign automotive semiconductor related enterprises on the application of vehicles. In the future, it will leverage its deep technological accumulation in the field of automotive electronics innovation, work together with upstream and downstream partners, and jointly promote industrial chain innovation to help accelerate the development of intelligent electric vehicles in China.